One of the important issues in wireless networks is the Routing problem that is effecting on system performance. Routing Algorithms are used to solve this issue effectively. One of such Routing Algorithm is embedded Bipolar-CMOS-DMOS (eBCD); it is based on Bee colony for energy consumption reduction in wireless relay networks. Recently Korean semiconductor manufacturer MagnaChip Semiconductor Corporation introduced a new version of its 0.18um eBCD technology.
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. The latest product uses a new binary-coded decimal (BCD), which provides minimal mask additions. Moreover, BCD supports high voltage range applications including DC-DC converters and regulators, low-distortion audio amplifiers, and battery management ICs for mobile and consumer markets. The new modular process will likely help MagnaChip meet customers’ demand for equipments that can support high voltage applications and are economic as well.
The BCD technology also uses high density logic devices and high performance analog devices, which are capable of supporting premium features available on standard logic processes, including multiple time programmable memory (MTP), one time programmable memory (OTP), fuse-based trim capabilities, high K metal-insulator-metal capacitors, copper wire bonding compatibility, thick low-cost aluminum top metallization, and low-cost redistribution layer (RDL) process options. The new modular process will likely help MagnaChip meet customers’ demand for equipments that can support high voltage applications and are economic as well. High-performance 12V to 30V Lateral-DMOS power devices are fully isolated from the substrate and features low Rsp (specific on resistance) for the applications where power device area and efficiency are critical. The isolation of the high voltage devices from the substrate is achieved without the use of costly epitaxial layers and buried layers, and sacrificing latch-up performance while minimizing substrate injection.
“We are very pleased to offer our new 0.18um embedded BCD process solution with features that support 12~30V power applications while minimizing manufacturing processing costs,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “Our modular based BCD process enables us to quickly support our customers’ unique manufacturing requirements for a variety of high voltage applications in a very timely fashion.” Recently, the company had also approved a share buyback program to repurchase up to $100 million of its common stock during the period from Aug 5, 2013 to Dec 15, 2014.